JetEtch TotalProtect幾乎可以開(kāi)封目前市場(chǎng)上所有的集成電路芯片封裝，而又不損壞芯片內(nèi)部組件的電氣屬性。美國(guó)Nisene科技集團(tuán)有限公司從事集成電路失效分析的自動(dòng)開(kāi)封裝置研發(fā)超過(guò)40年，擁有多項(xiàng)電化學(xué)及微波等離子開(kāi)封機(jī)技術(shù)的專li。

詳細(xì)介紹

TotalProtect Process - 美國(guó)*施加的電壓和冷卻系統(tǒng)解封裝。

全自動(dòng)化學(xué)芯片開(kāi)封機(jī)系統(tǒng)----JetEtch TotalPROTECT

美國(guó)Nisene的JetEtch TotalProtect系統(tǒng)配備了JetEtch Pro系列的所有強(qiáng)大功能。它具有CuProtect的專li偏置電壓應(yīng)用處理能力。它也具有特殊的冷卻功能，可以對(duì)蝕刻酸進(jìn)行低溫環(huán)境冷卻。結(jié)合偏置應(yīng)用序,TotalProtect為終用戶提供了大量的蝕刻參數(shù)，可用于幾乎無(wú)限的配方組合。

The JetEtch Pro TotalProtect is the world’s most advanced decapsulation system. With an unequaled feature set, the TotalProtect can etch the widest variety of any integrated circuits of any system on the market while maintaining the integrity of sensitive internal components. It is the new gold standard. Only from Nisene Technology Group.

主要特征（Features）:

Sub-Ambient Cooling
Daisy-Chaining Recipes
Same Specs as the CuProtect

What It Does.

The TotalProtect system comes equipped with all of the great features of the JetEtch Pro decapsulation system, as you might expect. It also comes with the patented bias voltage application process capability of the CuProtect. In addition to that, it ALSO has a special cooling feature that allows sub-ambient cooling of the etching acid. When combined with the bias application process, the TotalProtect offers the end user a tremendous range of etching parameters for virtually endless recipe combinations. It’s the total package for total protection. It’s the JetEtch Pro TotalProtect.

Protected Copper Wires

開(kāi)封樣例 ---- SEM高倍率放大

Let Us Prove It To You.

If you are interested in seeing what the TotalProtect can do and are interested in one of these systems for your facility, send us a set of samples and we’ll prove the concept for you free of charge.

關(guān)鍵詞：芯片