當(dāng)前位置：上海衡鵬企業(yè)發(fā)展有限公司>>半導(dǎo)體>>貼片/裝片 Die Attach

貼片/裝片 Die Attach

參考價(jià)

面議

具體成交價(jià)以合同協(xié)議為準(zhǔn)

產(chǎn)品型號(hào)

品牌

廠商性質(zhì)其他

所在地上海

在線詢價(jià) 收藏產(chǎn)品查看聯(lián)系電話

聯(lián)系方式：查看聯(lián)系方式

更新時(shí)間：2024-06-10 08:43:09瀏覽次數(shù)：90次

聯(lián)系我時(shí)，請(qǐng)告知來(lái)自環(huán)保在線

暫無(wú)信息

上海衡鵬企業(yè)發(fā)展有限公司

經(jīng)營(yíng)模式：其他

商鋪產(chǎn)品：635條

所在地區(qū)：

詢價(jià) 給他留言

產(chǎn)品簡(jiǎn)介

貼片/裝片 Die Attach

詳細(xì)介紹

Die Attach特點(diǎn)：

High-accuracy bonding by unique 3D-NRS technology

High-productivity and space-saving footprint by adopting twin-head

High-speed thin die pick-up system with a speed of 400ms / t:20um(option)

*Depending on material conditions

Friction-free bonding head with simultaneous positional and force control for thin die stacked devices

Cleanness control with HEPA-filter and stainless steel full cover

Equipped with die back-side camera on each bonding head,

enhancing inspection function with a total of 8 cameras

Capable of handling large substrates up to 120mm width x 300mm length

Die Attach規(guī)格參數(shù)：

Product Name	Die Bonder
Model	SPA-1000
Bonding Method	DAF bonding
Accuracy	XY：±5μm (3σ)、θ：±0.05°(3σ) (Machine accuracy excluding material-induced factors)
Productivity	The productivity increased by 2.5 times compared with conventional model. (Theoretical value with Shinkawa's standard sample)
Chip Size	□0.8 – 25mm
Wafer Size	Maximum 12-inch
Substrate/Leadframe Size	Width 40 – 120mm Length 180 – 300mm Thickness0.05 – 0.8mm
Options Available	Thin die application kit, Film attachment unit, capability to handle overhead transport (OHT)
Utilities	Input Power Supply：Single Phase AC200V±5%　50/60Hz (Other power supply options available on request)
	Power：Maximum 3.2 kVA (3.2kW)
	Consumption
	Air：500kPa (5kgf/cm2) 900 L/min
	Vacuum：Below -74kPa (-550mmHg) (gage)
Physical Dimensions and Mass	Approx. 2,280W × 1,510D × 1,670H mm　Approx. 2,300 kg (excludes monitor display and signal tower)